In the world of semiconductor fabrication, consistency, reliability and yield are critical at every part of the process. For over 20 years, 3M™ CMP Pad Conditioners have been providing innovative pad conditioning solutions to the world’s leading semiconductor fabricators.
From the exclusive sintered abrasive diamond technology behind 3M™ Diamond Pad Conditioners to the precisely micro-replicated patterns in 3M™ Trizact™ Pad Conditioners, our global technical team is committed to continually redefining the cutting edge of pad conditioner technology. Research and manufacturing facilities around the world provide convenient product support and product supplies.
3M™ Trizact™ Pad Conditioners are designed for advanced node processes where precision, reliability and consistency are vital. Using 3M’s proprietary microreplication process, virtually every aspect from overall shape to tip shape to height dispersion can be specified at the micro scale and manufactured out of diamond-coated ceramic.
3M™ Diamond Pad Conditioners refresh your CMP pad surfaces, minimize wear, and maintain consistent asperities and consistent pad performance – for wafer after wafer. Their single-layered diamond grid with highly controlled spacing helps enable you to better predict and optimize your CMP pad usage, for better planarization efficiency.
Featuring a metal-free construction and low cost of ownership, 3M™ CMP Pad Conditioner Brushes are used for CMP buff and pad cleaning applications.
Already have a CMP pad in use? We have many available pad conditioner variations for hard and soft pads, advanced node processes and more. Find the perfect balance of performance, price and other key pad conditioner properties for your process. Download our full product family guide (PDF, 344.13 KB).
Your form was submitted successfully! A representative will contact you within 3 business days.
An error has occurred while submitting. Please try again later...