3M™ MetPak™ 2-FB Inverse Header, MP2 Series
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Details
Highlights
- Three levels of early mate, late break (EMLB) sequencing or selective loading options
- Footprint compatible with standard Futurebus+(R)
- Solder tail with true-position wafer
- Ideal for hot swapping applications
2 mm 5-Row, Right Angle, Solder Tail
Specifications
Resources
