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3M™ MetPak™ 2-FB Inverse Header, MP2 Series

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Three levels of early mate, late break (EMLB) sequencing or selective loading options

Footprint compatible with standard Futurebus+(R)

Solder tail with true-position wafer

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Tech Data Sheet (PDF, 233KB)

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Highlights

Three levels of early mate, late break (EMLB) sequencing or selective loading options
Footprint compatible with standard Futurebus+(R)
Solder tail with true-position wafer
Ideal for hot swapping applications

2 mm 5-Row, Right Angle, Solder Tail

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