3M™ Four-Wall Condo Header 3000 Series

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Stacked pins conserve space on the circuit board for high-density packaging

Features up to 128 pins with latching

Excellent alternative to HDI

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Frequently viewed resources

Tech Data Sheet (PDF, 546KB)

Details

Highlights

  • Stacked pins conserve space on the circuit board for high-density packaging
  • Features up to 128 pins with latching
  • Excellent alternative to HDI
  • High-temp insulator allows for no-lead soldering
  • Mates with standard flat cable harnesses and accepts standard IDC sockets
  • Also allows for "paste in hole" reflow soldering

3M™ Four-Wall Condo Header 3000 Series features up to 128 stacked pins to conserve space on the circuit board for high-density packaging without HDI. This versatile wire-to-board header also allows for dense contacts while still including secure latch mechanisms. A high-temperature insulator that allows for no-lead soldering.

Excellent for “paste in hole” reflow soldering techniques as well, 3M™ Four-Wall Condo Header 3000 Series mates with standard flat cable harnesses and accepts standard IDC sockets.

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