Protect surfaces from advanced packaging heat and chemical processes for more consistency and better yields with 3M semiconductor process protection solutions.
3M solutions for semiconductor advanced packaging process protection
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With emerging technologies including 5G, autonomous driving, IoT and others creating an even greater demand for high performance computing and device connectivity, a driving force has been created that will shape the next several generations of technology and design innovation. Semiconductor chips must be smaller, thinner, faster and more functional. Advanced IC packaging is key to helping enable the performance needs but requires more and newer processes than ever before – and involves more chemicals, more films, and more extreme processing conditions. Learn how 3M can help.
Optimize product evaluation with tapes tested for protection
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When it comes to protecting your devices and components, consistent, high-quality materials from 3M are essential. Our process protection tapes undergo rigorous viability testing in adhesion, thermal and chemical resistance to meet the latest requirements in advanced IC packaging and related high-temperature processes.
A sample of our product viability testing for our process protection solutions include:
- Adhesion to a variety of materials
- Residue analysis
- Adhesion after thermal exposure and solder reflow
- Antistatic performance in-use and through temperature and chemical exposure
For specific thermal, time and chemistry requirements, our global material experts and product development network can team up with you to test materials and determine an ideal option for your processes.
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Key trends in semiconductor advanced packaging
Embedded die in substrate
A popular option for reducing form factor is embedded die in substrate. This innovative approach implants the IC within a laminate substrate, which can then be situated next to other components (other dice, MEMs, etc.) using copper-plated vias resulting in an integrated, multi-functional package.
Process protection solutions from 3M can enable the thermal and chemical processing steps of embedded die in substrate technology.
Discover 3M process protection solutions
Our solutions are designed for a broad range of processes including FOPoP, D2W hybrid bonding, RDL-last processes and others.
Explore sensors in new surroundings
Expanded possibilities in semiconductor design
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3M™ Heat Resistive Polyimide Tapes are excellent for helping protect sensors – valuable components which must endure extensive high-temperature and chemical processing steps in semiconductor assemblies. Not only that, they help you expand your design possibilities. These tapes are compatible with sensor housing materials such as diffusers, epoxy, poly amide, LCP and others, and bond without delamination or siloxane outgassing. They remove easily without residue, staining or static which can damage the substrate. Our semiconductor tapes for sensors meet clean room manufacturing standards.
Sensor protection process flow
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A. 3M™ Heat Resistive Polyimide Tape, B. Cover glass, C. Sensor chip, D. Housing
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- Taping on sensor packages
- Good heat resistance for multiple reflow cycles at 260 °C/500 °F without delamination
- No siloxane outgas
- Reflow process for one or more cycles
- Dl water/solvents cleaning process
- Removal of tape and inspection of residue
- Clean removal
- Antistatic performance
- Taping on sensor packages
High-performance lamination and masking solutions
Smoother, faster leadframe production
A selection of 3M leadframe tapes help speed production and reduce waste during die bonding, Au/Cu wire bonding and molding. Many of our heat-resistant QFN leadframe masking tape solutions are engineered to withstand the higher soldering temperatures required as the industry moves toward Cu wire bonding. Our laminating leadframe tapes deliver excellent ball shear performance, limiting die tilting and increasing throughput.
Process flow for leadframe tapes
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A. Leadframe, B. Die, C. Tape, D. Wire, E. Molding
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- Tape lamination on leadframe
- Easy lamination
- Die bonding
- Good heat resistance (up to 210°C/410 °F, for 30 minutes)
- Au/Cu wire bonding
- Good heat resistance (up to 230°C/446 °F, for 30 minutes)
- Plasma cleaning
- Good plasma resistance (up to 30 minutes)
- Molding
- Good heat resistance (up to 190°C/374 °F, for 5 minutes)
- Good ball shear performance – less die tilt
- Dicing, tape removal and final product
- Easy peel off
- Clean removal on leadframe and molding component
- Good plasma resistance for plasma cleaning
- Tape lamination on leadframe
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3M™ Heat Resistive Polyimide Tapes feature thermally cross-linkable acrylic adhesives on heat resistive polyimide backings. This provides good initial adhesion combined with less adhesion build-up after high temperature molding or reflow processes, as well as clean removal performance for masking, protection and carrier applications in semiconductor manufacturing. Find the tape that works for you.
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Product comparison table for heat resistance process tapes
Technical data sheets for 3M™ Heat Resistive Polyimide Tapes
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3M™ Heat Resistive Polyimide Tape 7414 -
3M™ Heat Resistive Polyimide Tape 7416Y -
3M™ Heat Resistive Polyimide Tape 7418E -
3M™ Heat Resistive Polyimide Tape 7418F
Connect with a 3M expert about 3M™ Heat Resistive Polyimide Tapes and future bump protection tapes
Better protection is possible. We’ve got teams in key locations all over the globe dedicated to pushing the potential of our tapes.
