cmp materials used for semiconductor production

Step up to the next level in semiconductor manufacturing

Redefining Chemical Mechanical Planarization (CMP)


What is chemical mechanical planarization (CMP)?

CMP (or chemical mechanical polishing) is when semiconductor wafers undergo repeated polishing and planarisation during fabrication to ensure that the wafer surface is flat and free of extraneous material before subsequent layer processing. This wafer fabrication process uses a combination of a textured hard or soft CMP pad, a CMP pad conditioner and a specialised slurry to polish the wafer.

As the CMP pad is used over time, it must be regularly conditioned with a polishing pad conditioner to maintain consistent polishing performance. CMP pad conditioners can be made of hard or soft materials, and they can be designed with a range of sizes, textures and features to condition different types of pads. Integrated optimisation of pad, slurry and conditioner is increasingly necessary to deliver the required CMP performance at advanced nodes.

Video about CMP materials used in the semiconductor manufacturing process

Create what’s next in semiconductor manufacturing

Unleash the power of CMP

Drawing from over 50 technology platforms, 3M develops high quality, consistent CMP disks. These are driven by our proprietary microreplication technology and expertise in surface modification, molding and adhesion. This dedication to consistency and customisation helps you gain more control over your chemical mechanical planarisation process and enjoy more cost-of-ownership benefits. What's more, our dedicated technical experts provide you with direct and personalised support. Local sampling and product iterations are available to you thanks to our global laboratory and manufacturing capabilities.

  • Illustration showing consistency of 3M™ CMP Pad

    • Quality materials
    • Reduced variation
    • Improved stability, predictability

  • Illustration showing control over CMP planarisation

    • Tailored solutions
    • Tunable attributes

  • Illustration showing cost-of-ownership benefits of using polishing pad conditioners
    Cost of Ownership

    • Less contamination risks
    • Reduced defectivity
    • Improved yield

  • Illustration showing customisation of CMP pads

    • Stable lifetime performance
    • Extended lifespan
    • Reduced tool downtime

Powering node-to-node CMP innovations for every tech generation

Innovation is at the core of 3M Semiconductor solutions. From technology breakthroughs for CMP pads to optimized CMP pad conditioners, we exceed expectations with partners like you.

Timeline of innovations by 3M in the chemical mechanical polishing process from 1998 to present

Pick your CMP solution for a smooth planarisation process

  • These advanced pads help you achieve consistent pad-to-pad performance, limit metal contamination risks and help you provide paradigm-shifting high planarization efficiency and low defect performance.

  • Explore 3M pad conditioning solutions, from 25 years of diamond pad technology and metal-free conditioner brushes to the latest precisely microreplicated patterns in 3M™ Trizact™ Pad Conditioners.

Ready to redefine your CMP process?

Our sales reps and technical teams are here to help.

*This information is based on tests performed at 3M laboratory facilities, and may be based on a limited sample size or a subset of 3M CMP materials. Many factors beyond 3M’s control and uniquely within the user’s control can affect the use and performance of 3M CMP materials in a particular semiconductor manufacturing application. To learn more about the specific properties and benefits of a given 3M CMP pad or 3M CMP pad conditioner, or to arrange a technical evaluation of the product, visit the 3M product catalog or contact 3M to speak with an expert.